Mixx Technologies Secures $33M Series A to Power the Next Era of AI Connectivity

As artificial intelligence (AI) workloads surge and data centers strain under mounting interconnect demands, one deep-tech startup is emerging as a linchpin in the future of compute infrastructure. With a recent $33 million Series A funding round, Mixx Technologies is redefining how AI systems communicate — using light instead of copper to overcome the fundamental data bottleneck that limits performance and scalability.

The $33 Million Series A: A Strong Vote of Confidence

In December 2025, Mixx Technologies, a San Jose–based optical interconnect startup, announced the close of a $33 million Series A funding round — led by ICM HPQC Fund with strategic participation from TDK Ventures, Systemiq Capital, Banpu Innovation & Ventures, G Vision Capital, Ajinomoto Group Ventures, AVITIC Innovation Fund and other partners. The oversubscribed round reflects robust investor belief in Mixx’s mission and technology as foundational for next-generation AI infrastructure

Mixx plans to use this capital to:

• Advance core product development and accelerate commercialization of its optical connectivity solutions.

• Scale research and development across multiple geographies, including the U.S., India, and Taiwan.

• Expand global footprint with engineering and ecosystem partnerships that support broad deployment of its technology.

The round positions Mixx to move from prototype to full-scale infrastructure deployments that can serve even the most demanding AI workloads — where traditional copper interconnects fail to keep pace.

Solving the AI Data Bottleneck: Why Mixx Matters

Modern AI models — particularly inference clusters — require data transfers at speeds and efficiencies far beyond what traditional electrical interconnects can deliver. Mixx’s solution shifts connectivity from copper-based links to optical interconnects, enabling dramatic improvements in:

• Bandwidth capacity

• Power efficiency

• Latency reduction

• Total cost of ownership for data centers

At the heart of this approach is the HBxIO™ silicon-integrated optical engine — a communication platform designed to bridge the computational demands of back-end AI processing and front-end networking without the energy and speed limitations of legacy technology.

CEO and co-founder Vivek Raghuraman highlighted the shift in system metrics:

“What once centered on link speeds and component efficiency must now account for system-wide power, latency, and reliability measured at the data-center level.”

This strategic focus on end-to-end data movement is what differentiates Mixx from traditional hardware architectures and positions it as a future backbone for AI compute worldwide.

Leadership, Team, and Deep-Tech DNA

Mixx Technologies was co-founded by Vivek Raghuraman (CEO) and Dr. Rebecca K. Schaevitz (Co-Founder & Chief Product Officer) — engineers with deep experience in optical interconnects and advanced semiconductor packaging. Their backgrounds include work on industry-leading silicon photonics and co-packaged optics technologies at major players such as Intel and Broadcom, giving the company a strong foundation in hardware systems that scale.

This domain expertise is critical: optical interconnects — particularly at multi-terabit speeds — are highly complex to design and manufacture. Mixx’s team brings decades of experience translating cutting-edge research into scalable, manufacturable infrastructure.

Global Expansion and Market Reach

With its latest funding, Mixx is actively building global R&D and deployment hubs:

• United States: Headquarters and advanced product development.

• India (Bengaluru): Growing engineering center.

• Taiwan: Planned manufacturing and operations base beginning early 2026 to support Asia-Pacific market growth.

This geographic diversification strengthens Mixx’s ability to support global customers — from cloud service providers to hyperscale AI deployments — while aligning engineering, manufacturing, and supply chain strategies for maximum impact.

Partnerships and Ecosystem Validation

The investor mix in Mixx’s Series A — which includes corporate venture arms like TDK Ventures — not only brings capital but also strategic domain expertise in materials science, sustainable tech, and electronics ecosystems. Investors like Systemiq Capital emphasize the broad market demand for sustainable, energy-efficient compute infrastructure — a priority as AI workloads drive up global data-center power consumption.

These partnerships signal belief not just in the company’s technology but in optical interconnects as a fundamental layer of future compute architectures.

Looking Ahead: Mixed Signals, Major Potential

The AI compute market is rapidly evolving. As models scale toward exabyte-level workloads — where trillions of parameters become the norm — the limitations of traditional electrical networks are becoming bottlenecks in performance, power, and cost. Mixx’s system-level optical infrastructure positions it at the forefront of this technological shift, offering a fabric optimized for:

• Ultra-high bandwidth

• Energy-efficient data transfer

• Flexible and scalable network topologies

• Lower computational overhead for inference workloads

This places Mixx in direct alignment with the next generation of AI infrastructure demands — where connectivity, not compute, may define performance ceilings.

Conclusion: Light-Speed Connectivity for the AI Century

Mixx Technologies’ $33 million Series A funding round is more than a capital milestone — it’s a validation of a foundational vision: that optical interconnects are essential to the future of AI infrastructure. With strong backers, a seasoned leadership team, and a technology platform engineered for ultra-high performance, Mixx is poised to become a cornerstone of next-generation compute ecosystems.

As AI scales into ever more demanding workloads, the company’s system-level approach to eliminating data bottlenecks could be the difference between incremental performance gains and transformative leaps in efficiency, power, and speed.